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US 2002/0172007 A1Published application
Spray evaporative cooling system and method
AssigneeCray Inc.
InventorGregory W. Pautsch
Life of this patent
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Abstract
A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.
Claims4
A method of cooling an electronics enclosure having a plurality of electronics components, comprising:
- heating a liquid to a temperature near its boiling point;
- directing the heated liquid against the electronics components such that a portion of the heated liquid vaporizes;
- drawing the vapor and the heated liquid away from the electronics components;
- and
- condensing the vapor back into liquid.
2 more elements
An enclosure, comprising:
- a plurality of electronics components;
- cooling means for cooling a gas;
- and
- distribution means for directing the gas across the electronics components and the cooling means;
- wherein the distribution means forms a closed system limiting the transfer of the gas both into and out of the distribution means.
2 more elements
Dependencies are inferred from the claim text.