Electronic device
AssigneeHitachi, Ltd.
InventorsTasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima, Tsuneo Endoh
Life of this patent
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Abstract
Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu etc. and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
Claims15
An electronic device comprising a semiconductor device provided with pads and a substrate provided with pads on which substrate said semiconductor device is mounted, the pads of the semiconductor device being bonded to the pads of the substrate through junctions each including Cu balls and Cu—Sn compounds containing Cu6Sn5, said Cu balls being bonded to each other by said Cu—Sn compounds.
An electronic device comprising a semiconductor device provided with pads and a substrate provided with pads on which substrate said semiconductor device is mounted, said pads of said semiconductor device being bonded to said pads of said substrate through solder portions each having Cu balls each surface of which is plated with one selected from the group consisting of Sn and a Sn-base alloy.
An electronic device comprising a semiconductor device provided with pads and a substrate provided with pads on which substrate said semiconductor device is mounted, said pads of said semiconductor device being bonded to said pads of said substrate through solder portions each having Cu balls and solder balls, a weight ratio of said solder balls to said Cu balls being in a range of 0.6 to 1.4.
An electronic device comprising a semiconductor device provided with pads, a first substrate provided with pads on which substrate said semiconductor device is mounted, and a second substrate provided with pads on which second substrate said first substrate is mounted,
- said pads of the semiconductor device being bonded to said pads of the first substrate through junctions each including Cu balls and a Cu6Sn5 compound, said Cu balls being bonded to each other by said Cu6Sn5 compound,
- said pads of the first substrate being bonded to said pads of the second substrate by one selected from the group consisting of a Sn—Ag-base solder, a Sn—Ag—Cu-base solder, a Sn—Cu-base solder and a Sn—Zn-base solder.
An electronic device comprising a semiconductor device provided with pads, a first substrate provided with pads on which substrate said semiconductor device is mounted, and a second substrate provided with pads on which second substrate said first substrate is mounted,
- said pads of the semiconductor device being bonded to said pads of the first substrate through solder portions each including Cu balls each surface of which is plated with one selected from the group consisting of Sn and a Sn alloy,
- said pads of the first substrate being bonded to said pads of the second substrate by one selected from the group consisting of a Sn—Ag-base solder, a Sn—Ag—Cu-base solder, a Sn—Cu-base solder and a Sn—Zn-base solder.
An electronic device comprising a semiconductor device provided with pads, a first substrate provided with pads on which substrate said semiconductor device is mounted, and a second substrate provided with pads on which second substrate said first substrate is mounted,
- said pads of the semiconductor device being bonded to said pads of the first substrate through solder portions each including Cu balls and solder balls, a weight ratio of said solder balls to said Cu balls being in a range of 0.6 to 1.4,
- said pads of the first substrate being bonded to said pads of the second substrate by one selected from the group consisting of a Sn—Ag-base solder, a Sn—Ag—Cu-base solder, a Sn—Cu-base solder and a Sn—Zn-base solder.
An electronic device comprising a semiconductor chip provided on one face thereof with connection terminals, and a substrate provided with connection terminals on which substrate said semiconductor chip is mounted,
- said connection terminals of said substrate and said connection terminals of said semiconductor chip are bonded to each other by wire bonding,
- another face of said semiconductor chip and said substrate being bonded to each other through bonding portions each containing Cu balls and Cu6Sn5 compounds, said Cu balls being bonded to each other by said Cu6Sn5 compounds.
Dependencies are inferred from the claim text.