Component and method for manufacture
AssigneeMotorola, Inc.
InventorsHEIDI L. DENTON, HENRY G. HUGHES, THOR D. OSBORN, DAXUE XU
Life of this patent
Estimating the term…
Abstract
A component (10) includes a substrate (15), a cap wafer (23), and a protection layer (28) formed over a surface of the cap wafer (23). Together, the protection layer (28) and the cap wafer (23) form a cap structure (39) that is bonded to the substrate (15) via a bonding layer (33). An opening (47) is formed in the cap wafer (23) by etching the cap wafer (23). The protection layer (28) provides protection during etching of the cap wafer (23) for the underlying bonding layer (33) and devices (11,12) formed in the substrate (15).
Claims24
A component, comprising:
- a substrate having a device thereon;
- a bonding layer disposed on a portion of a surface of the substrate;
- a cap wafer over the substrate;
- and
- a protection layer having a first surface and a second surface, wherein the first surface of the protection layer contacts a first surface of the cap wafer and the second surface of the protection layer is bonded to the surface of the substrate via the bonding layer and wherein the protection layer, the bonding layer, and the substrate form a cavity that encloses the device.
A method for manufacturing a component, comprising the steps of:
- providing a cap wafer;
- disposing a protection layer over a first surface of the cap wafer, wherein a first surface of the protection layer is bonded to the first surface of the cap wafer;
- disposing a bonding layer over a portion of a second surface of the protection layer;
- bonding the second surface of the protection layer to a surface of a substrate via the bonding layer;
- and
- forming an opening in the cap wafer after the step of disposing the bonding layer.
A method for manufacturing a component, comprising the steps of:
- bonding a cap to a substrate;
- and
- forming an opening in the cap after the step of bonding the cap to the substrate.
Dependencies are inferred from the claim text.