Heat sink for printed circuit board components
AssigneeEmerson Electric Co.
InventorsGregory A. Peterson, Jeffrey S. Stebner
Life of this patent
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Abstract
The present invention provides a heat sink for cooling a component. The component may be one of several components on a circuit board. The heat sink includes a tubular body and a plurality of internal fins. The tubular body has an interior surface and an exterior surface. At least a portion of the exterior surface being substantially flat. The plurality of internal fins extend from the internal surface and are generally symmetric around a center line of the tubular body. The substantially flat portion of the tubular body contacts the component to remove heat from the component. The heat sink may further include a plurality of exterior fins extending from the exterior surface of the tubular body.
Claims20
A heat sink for cooling a component, the heat sink comprising:
- a tubular body having an interior surface and an exterior surface, at least a portion of the exterior surface being substantially flat;
- and
- a plurality of internal fins extending from the interior surface of the tubular body, the plurality of internal fins being generally symmetric around a center line of the tubular body;
- wherein the substantially flat portion of the tubular body contacts the component to remove heat from the component.
A heat sink assembly for cooling a component on a circuit board, the heat sink assembly comprising:
- a tubular body having an interior surface, an exterior surface and two open ends, at least a portion of the exterior surface being substantially flat;
- the interior surface having a plurality of internal fins extending from the interior surface of the tubular body, the plurality of internal fins being generally symmetric around a center line of the tubular body;
- a fan attached to one of the two open ends of the tubular body to force ambient air through the tubular body;
- wherein the substantially flat portion of the tubular body contacts the component to remove heat from the component.
A cooktop comprising:
- a cooking plate;
- a plurality of heating units mounted below the cooking plate;
- a controller housing unit mounted below the cooking plate;
- a circuit board for controlling the heating units, the circuit board having a plurality of components, the circuit board mounted inside the controller housing unit;
- a heat sink assembly for cooling the plurality of components of the circuit board, the heat sink assembly attached to the circuit board, the heat sink mounted inside the controller housing unit, the heat sink assembly having
- a tubular body having an interior surface, an exterior surface and two open ends, the interior surface having a plurality of internal fins extending from the interior surface of the tubular body;
- a fan attached to one of the two open ends of the tubular body to force ambient air through the tubular body;
- wherein the exterior surface of the tubular body contacts the plurality of components to remove heat from the components.
Dependencies are inferred from the claim text.