Evaporator of CPL cooling apparatus having fine wick structure
AssigneeSamsung Electronics Co., Ltd.
InventorsHye-Jung Cho, Yong-Soo Lee, Seog-Woo Hong, In-Seob Song
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AssigneeSamsung Electronics Co., Ltd.
InventorsHye-Jung Cho, Yong-Soo Lee, Seog-Woo Hong, In-Seob Song
Estimating the term…
An evaporator of a capillary pumped loop (CPL) cooling apparatus having a fine wick structure is provided. The evaporator having a flat board shape, of a capillary pumped loop (CPL) cooling apparatus includes a coolant storing part for storing in-flowing coolant from the condenser and collecting a uncondensed gas contained in the in-flowing coolant in an upper space, a cooling part for cooling the heating body through vaporization of the coolant, and superstructure and substructure combined with each other, for defining a channel region in which the coolant flows from the coolant storing part to the cooling part by a capillary action. In this case, the substructure includes a first substructure used as a substrate and a second substructure formed along a border of the substrate, or includes first through third segments equal to the first and second substructures. The channel region is formed between the second segment and the superstructure, and a pumping means formed of patterns that are formed so that the capillary action is generated in the coolant, or a porous material is included in the channel region.
An evaporator of a capillary pumped loop (CPL) cooling apparatus comprising a condenser, an evaporator for being supplied coolant from the condenser and cooling a heating body according to variation in a phase of the coolant, the evaporator having a flat board shape, of a CPL cooling apparatus comprising:
Dependencies are inferred from the claim text.