Method of cooling devices
AssigneeAndo Electric Co., Ltd.
InventorYouichi Ito
Life of this patent
Estimating the term…
Abstract
It is intended to extend life spans of devices as a whole by reducing differences of temperatures of devices which are mounted on a printed circuit board by plural number without increasing the volume of cooling gas. In the method of cooling multiple driver's ICs which are continuously mounted on a printed circuit board, the devices having heat sinks provided with multiple radiating fins disposed thereon in parallel with one another, each radiating fin is positioned relative to a blowing direction of cooling gas at a given inclination angle θ.
Claims17
A method of cooling devices continuously mounted on a printed circuit board, the devices having heat sinks provided with multiple radiating fins disposed thereon in parallel with one another, wherein each radiating fin is positioned relative to a blowing direction of cooling gas at a given inclination angle θ.
Dependencies are inferred from the claim text.