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US 2002/0170237 A1Published application
Polishing slurry for the chemical-mechanical polishing of silica films
OwnerKristina Vogt, Lothar Puppe +3inventors
InventorsKristina Vogt, Lothar Puppe, Chun-Kuo Min, Li-Mei Chen, Hsin-Hsen Lu
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Abstract
A polishing slurry for chemical-mechanical polishing, containing 5 to 50% by weight of a colloidal silica abrasive, and from about 0.1 to about 10% by weight of a quaternary ammonium salt which is represented by the formula R4N+X−, where R may be identical or different and is selected from the group consisting of alkyl, alkenyl, alkylaryl, arylalkyl and an ester group, and X is hydroxyl or halogen, is distinguished by a high polishing rate.
Claims10
A polishing slurry for chemical-mechanical polishing comprising:
- (a) from about 5 to about 50% by weight of a colloidal silica abrasive, and
- (b) from about 0.1 to about 10% by weight of a quaternary ammonium salt which is represented by the formula R4N+X−, wherein each R can be identical or different and is selected from the group consisting of alkyl, alkenyl, alkylaryl, arylalkyl and an ester groups, and wherein X is hydroxyl or halogen.
Dependencies are inferred from the claim text.