Method and apparatus for drying semiconductor wafers
AssigneeUnited Microelectronics Corp.
InventorFu-Sheng Peng
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Abstract
The present invention provides a method and an apparatus for drying semiconductor wafers by using an IPA drying apparatus. The present invention uses a vapor generator to generate an IPA vapor. The IPA vapor is generated and saved in a closed surrounding and then transferred in a porous hollow plate in the dryer tank by using a quartz pipe. The IPA vapor is diffused evenly from the porous hollow plate. Furthermore, the present invention increases the safety of the process and can easily control the input amount of the IPA vapor.
Claims20
A method for drying semiconductor wafers by using drying apparatus, said method comprising:
- evaporating a solution to generate a vapor, wherein said solution can generate a co-solution with water and said co-solution can evaporate at a temperature lower than 100° C.;
- providing a dryer tank;
- piping said vapor to a porous hollow plate in said dryer tank;
- and
- drying at least one wafer in said dryer tank, wherein said vapor is evenly diffused from said porous hollow plate.
A method for drying semiconductor wafers by using an IPA (isopropyl alcohol) drying apparatus, said method comprising:
- evaporating an a IPA solution to generate an IPA vapor;
- providing a dryer tank, wherein said dryer tank is made of quartz;
- piping said IPA vapor from to a porous hollow plate on a bottom of said dryer tank by using a quartz pipe, wherein said porous hollow plate has a porous surface which is faced up;
- and
- drying at least one wafer in said dryer tank, wherein said IPA vapor is evenly diffused from said porous surface.
An apparatus for drying semiconductor wafers by using a drying apparatus, said apparatus comprising:
- a vapor generator to generate a vapor;
- a pipe to transfer said vapor, wherein one side of said pipe is connected to said vapor generator;
- and
- a dryer tank, wherein a porous hollow plate is on a bottom of said dryer tank and connected to another side of said pipe, wherein said porous hollow plate has a porous surface faced up in said dryer tank and said vapor is evenly diffused from said porous surface.
An apparatus for drying semiconductor wafers by using an IPA (isopropyl alcohol) drying apparatus, said apparatus comprising:
- a vapor generator to generate an IPA vapor;
- a pipe to transfer said IPA vapor, wherein one side of said pipe is connected to said vapor generator, wherein said pipe further comprises a valve and a pressure gauge on said pipe to control the input amount of said IPA vapor;
- and
- a dryer tank, wherein a porous hollow plate is on a bottom of said dryer tank and connected to another side of said pipe, wherein said porous hollow plate has a porous surface faced up in said dryer tank and said vapor is evenly diffused from said porous surface.
Dependencies are inferred from the claim text.