Wafer processing apparatus and method

Abstract

A method and apparatus are described for transferring processing structures between first and second processing environments. The apparatus includes a first apparatus compartment configured to provide the first processing environment and a second apparatus compartment configured to provide the second processing environment. The apparatus is preferably configured for transferring wafer structures between the processing environments. The first and second processing environments are coupled together through a transfer passage that is opened and closed in order to isolate the wafer in a small transfer volume between the processing environments. Preferably, the transfer passage is opened and closed with first and second movable tables to create the small volume transfer cavity. In operation, the wafer is isolated within the small volume transfer cavity and the first and second tables are individually raised and lowered to expose the wafer to the first and second processing environments without opening the transfer passage between the first and second apparatus compartments. According to an embodiment of the invention, the apparatus is configured with a chemical delivery system that monitors the chemical composition or chemical concentration within the second apparatus compartment and supplies the appropriate quantity of chemical or chemicals to maintain a selected composition or concentration therein. According to a preferred embodiment the apparatus is configured for processing wafers coated with silicon-based materials to produce porous low-k coatings.

Dependencies are inferred from the claim text.