Method for producing metal mask and metal mask
AssigneeEastman Kodak Company
InventorKiyoshi Ogawa
Life of this patent
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Abstract
A method for manufacturing a metal mask that facilitates easy dimensional control in the manufacturing process and can manufacture multiple metal masks having high and consistent precision. A Cr film 2 having a mask pattern 2a is formed on the surface of a glass plate 1, a dry film 4 is formed on the Cr film 2, the dry film 4 is exposed from the glass plate 1 side with the Cr film 2 as a mask, a mask pattern 4a having the same shape as that of the mask pattern 2a is formed on the dry film 4, and a metal plating layer 6 is formed on the Cr film 2. The metal plating layer 6 is separated to form a metal mask 7.
Claims14
A method for manufacturing a metal mask, comprising the steps of:
- (a) forming an electroconductive film having a mask pattern on one principle surface of a transparent plate or a transparent film;
- (b) forming a photosensitive film on the electroconductive film;
- (c) exposing said photosensitive film from side of said transparent plate or transparent film with said electroconductive film as a mask to form a mask pattern on the photosensitive film having the same shape as that of said mask pattern of the electroconductive film;
- (d) forming a metal plating layer on said electroconductive film;
- and
- (e) separating the metal plating layer to form the metal mask.
A method for manufacturing a metal mask, comprising the steps of:
- (a) providing a substrate with an electroconductive film formed on one principle surface of a transparent plate or a transparent film;
- (b) forming a first resist film on the electroconductive film of the substrate;
- (c) forming a first mask pattern on the first resist film;
- (d) etching said electroconductive film with the resist film as a mask;
- (e) removing the first resist film;
- (f) forming a second resist film on the electroconductive film;
- (g) exposing the second resist film from side of said transparent plate or transparent film with said electroconductive film as a mask to form a second mask pattern on said second resist film;
- (h) forming a metal plating layer by electroplating on said electroconductive film;
- and
- (i) separating the metal plating layer to form the metal mask.
A method for manufacturing a metal mask, comprising the steps of:
- (a) providing a substrate with an electroconductive film formed on one principle surface of a transparent plate or a transparent film;
- (b) forming a first resist film on the electroconductive film of the substrate;
- (c) forming a first mask pattern on the first resist film;
- (d) etching said electroconductive film with the resist film as a mask;
- (e) removing the first resist film;
- (f) forming a metal plating layer by electroplating on said electroconductive film;
- and
- (g) separating the metal plating layer to form a metal mask having a mask pattern in the same shape as that of said first mask pattern.
A method for manufacturing a metal mask, comprising the steps of:
- (a) providing a substrate with an electroconductive film formed on one principle surface of a dielectric plate;
- (b) forming a first resist film on the electroconductive film of the substrate;
- (c) forming a first mask pattern on the first resist film;
- (d) etching said electroconductive film with the resist film as a mask;
- (e) removing the first resist film;
- (f) forming a metal plating layer by electroplating on said electroconductive film;
- and
- (g) separating the metal plating layer to form a metal mask having a mask pattern in the same shape as that of said first mask pattern.
A method for manufacturing a metal mask, comprising the steps of:
- (a) forming an electroconductive film having a mask pattern on one principle surface of a transparent plate or a transparent film;
- (b) forming a metal plating layer on the electroconductive film;
- and
- (c) separating the metal plating layer to form a metal mask having a mask pattern with the same shape as that of said mask pattern.
A method for manufacturing a metal mask, comprising the steps of:
- (a) forming an electroconductive film having a mask pattern on one principle surface of a dielectric plate;
- (b) forming a metal plating layer on the electroconductive film;
- and
- (c) separating the metal plating layer to form a metal mask having a mask pattern with the same shape as that of said mask pattern.
A metal mask obtained by separating a metal plating layer formed on a electroconductive film having a predetermined mask pattern formed on a dielectric plate wherein the metal mask has an opening with a tapered shape widening from the separated surface toward the opposite side and the widest opening is at side of the separated surface.
Dependencies are inferred from the claim text.