Use of doped synthetic polymer materials for packaging of power electric assemblies for a liquid cooled module
OwnerDerrick E. Cook, Peter A. Hatch +1inventors
InventorsDerrick E. Cook, Peter A. Hatch, Paul William Keberly
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Abstract
The invention is a doped synthetic polymer materials for packaging of power electric assemblies. The polymer provides electromagnetic interference (EMI) shielding using such materials as nickel, carbon fiber, aluminum or other such characteristic elements. The invention provides structural integrity for power electronic packaging, while reducing cost, size, weight and design flexibility over the prior art. The illustrated embodiment is a liquid cooled turbulent flow power electronic assembly.
Claims12
A synthetic polymer material for packaging power electric assemblies for a liquid cooled module.
A liquid cooled turbulent flow power electronic assembly using a doped synthetic polymer comprising:
- a housing comprising turbulent flow features, an inlet and outlet for coolant and an open end comprising a flat edge around a perimeter of the open end for receiving an O-ring;
- a heat conducting backplate to attach electronic components to be cooled comprising a backplate flat edge to match the housing flat edge to receive and seal against the housing flat edge;
- and
- an attachment means to attach the assembly housing and backplate.
Dependencies are inferred from the claim text.