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US 2002/0162672 A1Published application
Use of doped synthetic polymer materials for packaging of power electric assemblies
OwnerDerrick E. Cook, Peter A. Hatch +1inventors
InventorsDerrick E. Cook, Peter A. Hatch, Paul William Keberly
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Abstract
The invention is a doped synthetic polymer material for packaging of power electric assemblies. The polymer provides electromagnetic interference (EMI) shielding using such materials as nickel, carbon fiber, aluminum or other such characteristic elements. The invention provides structural integrity for power electronic packaging, while reducing cost, size, weight and design flexibility over the prior art.
Claims11
A synthetic polymer material for packaging power electric assemblies.
A power electronics assembly using a doped synthetic polymer comprising:
- a housing shaped to cover the power electronics comprising an open end with a flat edge;
- a thermal-conductive plate comprising a flat edge to match and seal against the housing flat edge;
- and
- an attachment means to attach the housing and plate.
1 more element
Dependencies are inferred from the claim text.