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US 2002/0162645 A1Published application
Heatsink assembly having stabilzation plate
OwnerChih-Chong Wang, Guo-Ming Huang +2inventors
InventorsChih-Chong Wang, Guo-Ming Huang, Hung-Chou Chan, Ming-Chu Hou
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Abstract
A heatsink assembly having a stabilization plate is described. The stabilization plate, such as an n-shaped PORON slice, is disposed under a heatsink, and is surrounding a thermal pad under the heatsink. The stabilization plate is helpful to stabilize the combination of the thermal pad up to the heatsink. With the stabilization, the thermal pad is efficiently stuck on to a die for dissipating the heat therefrom.
Claims14
A heatsink assembly, comprising:
- a heatsink;
- a thermal pad located under the heatsink;
- a PORON slice, being located on a bottom of the heatsink and surrounding the thermal pad, for making the thermal pad closely compact to a die of a chip when the heatsink is located on the chip;
- and
- an amount of paste, coated on the PORON slice, for sticking the PORON slice on the bottom of the heatsink.
2 more elements
A cooling assembly, comprising:
- an n-shaped PORON slice;
- and
- a heatsink, stuck with the n-shaped PORON slice.
Dependencies are inferred from the claim text.