Method and device for treating a substrate
AssigneeKarl Suss France
InventorGilbert Cavazza
Life of this patent
Estimating the term…
Abstract
The invention concerns a method and a device for treating a substrate of an integrated circuit or the like during production. The invention is characterised in that it consists in spraying, from the bottom upwards, a treatment liquid (24) on the surface to be treated (20I), facing downwards, of said substrate (20) and transducers (8) apply ultrasonic waves to said substrate (20) via said spayed treatment liquid (24).
Claims12
A method for treating the substrate (20) of an integrated circuit or similar product during manufacture, the aim of said treatment being at least to remove, using the action of at least one treatment liquid (24), unwanted particles borne by a face (20I) to be treated of said substrate (20) and said substrate being held, during said treatment, so that said face (20I) to be treated is directed downward, characterized:
- in that said treatment liquid (24) is sprayed from the bottom upward over said face (20I) to be treated;
- and
- in that ultrasound waves are applied to said treatment liquid (24), which transmits said waves upto said substrate (20).
Dependencies are inferred from the claim text.