Sleeve assembly for an electronic chip
AssigneeHewlett-Packard Development Company, L.P.
InventorRyan Abbott
Life of this patent
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AssigneeHewlett-Packard Development Company, L.P.
InventorRyan Abbott
Estimating the term…
A sleeve assembly for housing and protecting an electronic chip. The sleeve assembly includes a first sleeve member and a second sleeve member attached to the first sleeve member. The first sleeve member includes at least one substrate engaging member adapted to be inserted into an engaging member hole located on a substrate and at least one chip guiding member adapted to substantially correctly align an electronic chip with a socket when the electronic chip is inserted into the sleeve assembly. Additionally, the at least one engaging member and the at least one chip guiding member extend from a lower surface of the sleeve assembly. The sleeve assembly serves to protect the electronic chip from physical and electrostatic discharge damage during storage as well as after the electronic chip is mated with the socket.
A sleeve assembly for housing an electronic chip, said sleeve assembly comprising:
A system for protecting and guiding an electronic chip into engagement with a socket, said system comprising:
A method for protecting and guiding an electronic chip on to a socket positioned on a substrate of an electronic system, said method comprising the steps of:
Dependencies are inferred from the claim text.