Nickel-titanium sputter target alloy
AssigneePraxair S.T. Technology, Inc.
InventorsHolger J. Koenigsmann, Paul S. Gilman, Thomas J. Hunt
Life of this patent
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Abstract
The sputter target deposits nickel from a binary alloy. The binary alloy contains, by weight percent, 9 to 15 titanium and the balance nickel and incidental impurities. The binary alloy has, by weight percent, 35 to 50 TiNi3 needle-like intermetallic phase and balance α-nickel phase. The TiNi3 needle-like intermetallic phase and α-nickel phase are formed from a eutectic decomposition. The α-nickel phase having a grain size between 50 and 180 μm. The binary alloy has a Curie temperature of less than or equal to a temperature of 25° C. and exhibits paramagnetic properties at temperatures of 25° C. or lower.
Claims14
A sputter target for depositing nickel comprising a binary alloy consisting essentially of, by weight percent, about 9 to 15 titanium and the balance nickel and incidental impurities, the binary alloy having, by weight percent, about 35 to 50 TiNi3 needle-like intermetallic phase and balance α-nickel phase, the TiNi3 needle-like intermetallic phase and α-nickel phase being formed from a eutectic decomposition, the α-nickel phase having a grain size between about 50 and 180 μm and the binary alloy having a Curie temperature of less than or equal to a temperature of about 25° C. and exhibits paramagnetic properties at temperatures of about 25° C. or lower.
A method of forming a binary nickel-titanium sputter target blank comprising the steps of:
- casting a binary alloy into an ingot, the ingot consisting essentially of, by weight percent, about 9 to 15 titanium and the balance nickel and incidental impurities, the binary alloy having, by weight percent about 35 to 50 TiNi3 intermetallic phase and balance α-nickel phase;
- dissolving the TiNi3 intermetallic phase into a single α-nickel phase at a temperature of at least about 1000° C.;
- hot working the ingot at a temperature between about 1000° C. and the ingot melting temperature to form the target blank, to reduce thickness of the ingot by at least fifty percent and to reduce grain size of the α-nickel phase;
- and
- cooling the target blank to precipitate needle-like TiNi2 intermetallic phase in an α-nickel phase matrix, the grain size of the α-nickel phase matrix being between about 50 and 180 μm and the binary alloy having a Curie temperature of less than or equal to a temperature of about 25° C. and exhibits paramagnetic properties at temperatures of about 25° C. or lower.
A method of forming a binary nickel-titanium sputter target comprising the steps of:
- casting a binary alloy into an ingot, the ingot consisting essentially of, by weight percent, about 9 to 15 titanium and the balance nickel and incidental impurities, the binary alloy having, by weight percent, about 35 to 50 TiNi3 intermetallic phase and balance α-nickel phase;
- dissolving the TiNi3 intermetallic phase into a single α-nickel phase at a temperature of at least about 1000° C.;
- hot rolling the ingot at a temperature between about 1050 and 1150° C. to form the target blank, to reduce thickness of the ingot by at least fifty percent and to reduce grain size of the α-nickel phase grain size;
- maintaining temperature of the ingot at a temperature of between about 1050 and 1150° C. during the rolling;
- and
- cooling the target blank to precipitate needle-like TiNi3 intermetallic phase in an α-nickel phase matrix, the grain size of the α-nickel phase matrix being between about 50 and 180 μm and the binary alloy having a Curie temperature of less than or equal to temperatures of about 25° C. and exhibits paramagnetic properties at temperatures of about 25° C. or lower.
Dependencies are inferred from the claim text.