US 2002/0159722 A1 · Transmission optical module

Abstract

A light-emitting device assembly in the transmission optical module in accordance with the present invention accommodates a light-emitting device in a case, whereas a connection pin electrically connected to the anode of the light-emitting device extends outward from the case. The module also has a circuit board on which an electronic device for controlling the light-emitting device is mounted, whereas the circuit board is mounted in a board mounting part of a lead frame. The circuit board is provided with a first pad to which a predetermined potential is applied, and a second pad for supplying a source voltage, whereas wires bonding the connection pin to the first and second pads respectively.

Claims3

Dependent claims

A transmission optical module comprising:

a light-emitting device assembly having a light-emitting device, a case for accommodating said light-emitting device, and a connection pin extending outward from said case and electrically connected to an anode of said light-emitting device;
a circuit board, on which an electronic device for controlling said light-emitting device is mounted, and having a first pad to which a predetermined potential is applied and a second pad for supplying a source voltage;
a lead frame having a board mounting part for mounting said circuit board;
and
wires bonding said connection pin to said first pad and second pads respectively.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/122,720Filed 16 Apr 2002

Priority

JP P2001-12971426 Apr 2001

Published

31 Oct 2002

Term ends

Not estimatedThe source records don’t support an estimate.

Classification5 codes

G02B 6/4201
Coupling light guides with opto-electronic elements: packages, e.g. shape, construction, internal or external details
G02B 6/4204
Packages, e.g. shape, construction, internal or external details: the coupling comprising intermediate optical elements, e.g. lenses, holograms
H10W 90/756
Of bond wires: between a chip and a stacked lead frame, conducting package substrate or heat sink
G02B
Optical elements, systems or apparatus

Transmission optical module

Life of this patent

Transmission optical module

Life of this patent

Abstract

Claims3