Structure and method for constructing circuit module suitable for hand-held electronic equipment
AssigneeKabushiki Kaisha Toshiba
InventorsHiroshi Ubukata, Kentaro Tomioka
Life of this patent
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Abstract
A circuit module mounting structure and a method for mounting an IC chip in the circuit module applicable to electronic equipment with a slim body. To increase radiation efficiency of the heat emitted from the IC chip, a heat conducting element including a plurality of thin plates is provided between a radiation plate of a heat sink unit and a surface of the IC chip. Further, the plurality of thin plates of the heat conducting element have sufficient flexibility to absorb stresses appearing at coupling portions of the elements due to dimensional tolerances of the elements.
Claims12
A circuit module structure, comprising:
- a wiring base board provided with a wiring pattern;
- an electronic element mounted on the wiring base board;
- a heat sink unit fixed on the wiring base board for radiating heat emitted from the electronic element, the heat sink unit including a radiation panel facing toward the electronic element and having a heat conductivity;
- and
- a heat conducting element provided between a surface of the heat sink unit facing the electronic element and a surface of the electronic element, the heat conducting element comprising a plurality of thin plate-like members having a heat conductivity substantially the same as that of the radiation panel and for transferring the heat emitted from the surface of the electronic element to the radiation panel and a predetermined flexibility for absorbing stresses generated due to dimensional tolerances of the electronic element.
An electronic equipment, comprising:
- a main body for housing a circuit module, the circuit module having a plurality of circuits for working the electronic equipment,
- the circuit module including:
- a base board provided with a wiring pattern;
- an IC chip mounted on the base board;
- and
- a heat sink unit fixed on the base board, the heat sink unit including a radiation panel facing toward the IC chip and a heat conducting element provided between the IC chip and the radiation panel of the heat sink unit, the heat conducting element including a plurality of thin plates each having a heat conductivity for transferring heat emitted from the IC chip to the heat sink unit and a predetermined flexibility for preventing stress from being applied to the IC chip.
Dependencies are inferred from the claim text.