Cooling plate arrangement for electronic components
AssigneeHewlett-Packard Development Company, L.P.
InventorsChandrakant D. Patel, Hannsjorg Obermaier, Vernon Alan Barber
Life of this patent
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Abstract
An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains an electronic component. The apparatus includes a heat conductive member having a first lateral edge shaped to slidably attach and retain the heat conductive member to a portion of the housing. A top surface of the housing includes a second edge shaped to slidably receive and retain the heat conductive member.
Claims20
An apparatus for cooling an electronic component, the apparatus coupled to a housing that contains an electronic component, the apparatus comprising:
- a heat conductive member having a first lateral edge shaped to slidably attach and retain the heat conductive member to a portion of the housing, wherein a top surface the housing includes a second edge shaped to slidably receive and retain the heat conductive member.
A cooling arrangement for an electronic component comprising:
- a housing with a first dovetail-shaped edge on a top portion of the housing, the housing enclosing the electronic component;
- and
- a first heat conductive member with a second dovetail-shaped edge to slidably attach the first heat conductive member to the housing via the first dovetail-shaped edge of the housing.
A cooling arrangement for an electronic component disposed on a circuit board, the cooling arrangement comprising:
- a housing with a first edge on a top portion of the housing, a bottom portion of the housing being in thermal contact with and configured to enclose the electronic component;
- and
- a first heat conductive member with a second edge shaped to slidably attach the first heat conductive member to the housing via the first edge of the top portion of the housing.
Dependencies are inferred from the claim text.