Method for fabricating an isolated microelectromechanical system (MEMS) device incorporating a wafer level cap
AssigneeRockwell Automation Technologies, Inc.
InventorsRichard D. Harris, Michael J. Knieser, Robert J. Kretschmann, Mark A. Lucak
Life of this patent
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Abstract
A MEMS structure is provided having a cap that encapsulates and protects the fragile components of the device, while having an electrical trace embedded in a nonconductive substrate. The electrical trace includes a first terminal end that is exposed to the peripheral region of the device, and a second end that is connected to the MEMS structure to facilitate operation of the device.
Claims46
A MEMS structure comprising:
- a substrate;
- at least one conductive element that is in mechanical communication with the substrate and that extends therefrom;
- a movable MEMS element having a portion that is free from the substrate and positioned such that a gap separates the movable MEMS element from the at least one conductive element;
- at least one electrical trace having a first terminal end in electrical communication with the at least one conductive element and a second terminal end in electrical communication with a peripheral region;
- and
- a cap attached to the substrate inside the peripheral region having upper and side walls that encapsulate the at least one conductive element and the movable MEMS element.
A method for manufacturing a MEMS structure, comprising:
- connecting a wafer to a substrate via an interface;
- forming a channel within the interface having a first terminal end facing the wafer, and a second terminal end exposed to a peripheral region;
- filling the recess with a conductive material;
- etching the wafer so as to produce a stationary member in mechanical communication with the substrate via the interface and a movable member spaced from the stationary member via a gap;
- and
- bonding a cap to the wafer so as to encapsulate the stationary and movable members.
A MEMS structure disposed within a peripheral region comprising:
- a substrate;
- a movable MEMS element having a distal end in mechanical communication with the substrate, and a middle portion disposed its two distal ends free from the substrate;
- and
- a cap attached to the substrate having upper and side walls that encapsulate the at least one conductive element and the movable MEMS element.
A MEMS structure surrounded by a peripheral region, the MEMS structure comprising:
- a substrate;
- at least one stationary element that is in mechanical communication with the substrate;
- a movable MEMS element disposed adjacent the conductive element, and having a distal end in mechanical communication with the substrate, and a middle portion disposed between its two distal ends free from the substrate;
- and
- at least one electrical trace having a first terminal end in electrical communication with the at least one stationary element and a second terminal end in electrical communication with the peripheral region.
A MEMS structure surrounded by a peripheral region, the MEMS structure comprising:
- a substrate;
- a first and second stationary elements in mechanical communication with the substrate;
- a movable MEMS element disposed adjacent the conductive element, and having a distal end in mechanical communication with the substrate, and a middle portion disposed between its two distal ends free from the substrate;
- and
- a first and second electrical trace having first terminal ends in electrical communication with the first and second stationary elements, respectively, and having second terminal ends in electrical communication with the peripheral region.
Dependencies are inferred from the claim text.