Semiconductor device, method of manufacturing electronic device, electronic device, and portable infromation terminal

A semiconductor device, comprising:

• a wiring substrate including electrodes on a top surface and a back surface thereof;
• projecting electrodes formed on one surface of said wiring substrate so as to have a prescribed height;
• a semiconductor chip having a thickness smaller than said height of said projecting electrodes and mounted on said one surface of said wiring substrate so as to be electrically connected to said electrodes of said wiring substrate;
• and an electronic component mounted on the other surface of said wiring substrate so as to be electrically connected to said electrodes of said wiring substrate, said electronic component having a thickness larger than that of said first semiconductor chip and having a linear expansion coefficient smaller than that of said wiring substrate.

An electronic equipment, comprising:

• a mounting board;
• a wiring substrate including electrodes on a top surface and a back surface thereof and mounted on said mounting board with projecting electrodes interposed therebetween, said projecting electrodes having a prescribed height;
• a semiconductor chip having a thickness smaller than said height of said projecting electrodes and mounted on a surface of said wiring substrate facing said mounting board such that said semiconductor chip is disposed in a space between said mounting board and said wiring substrate and electrically connected to said electrodes of said wiring substrate;
• and an electronic component mounted on a surface of said wiring substrate opposite to that facing said mounting board such that said electronic component is electrically connected to said electrodes of said wiring substrate, said electronic component having a thickness larger than that of said semiconductor chip and having a linear expansion coefficient smaller than that of said wiring substrate.

A portable information terminal, comprising:

• a housing;
• a mounting board mounted in said housing;
• a logic LSI chip mounted on said mounting board;
• a wiring substrate including electrodes on a top surface and a back surface thereof and mounted on said mounting board with projecting electrodes interposed therebetween, said projecting electrodes having a prescribed height;
• a memory or logic LSI chip having a thickness smaller than said height of said projecting electrodes and mounted on a surface of said wiring substrate facing said mounting board such that said memory or logic LSI chip is disposed in a space between said mountingboard and said wiring substrate and electrically connected to said electrodes of said wiring substrate;
• and an electronic component mounted on a surface of said wiring substrate opposite to that facing said mounting board such that said electronic component is electrically connected to said electrodes of said wiring substrate, said electronic component having a thickness larger than that of said semiconductor chip and having a linear expansion coefficient smaller than that of said wiring substrate.