Solid imaging device and method of fabricating the same

A method of fabricating a solid imaging device comprising,

• the first process of etching a plate means, wherein the plate means is optically transparent and physically rigid, and eliminating a portion of said plate means corresponding to a pad portion by sandblasting;
• the second process of matching and attaching the etched side of the plate means onto a periphery of a image sensor on a wafer;
• the third process of dicing the image sensor from the wafer;
• the fourth process of die bonding the diced image sensor to a ceramic package or PCB;
• and
• the fifth process of wire bonding the pad portion of the image sensor to the package or PCB and molding the image sensor.

A solid imaging device comprising,

• a solid imaging element secured in the center portion of a package by die bonding with use of a conductive adhesive;
• a side wall formed directly on the upper surface of the solid imaging element, wherein the side wall has a constant height and surrounds a image sensing area of the solid imaging element;
• and
• a cover means formed on the side wall, wherein the cover means is optically transparent and physically rigid.

A method of fabricating a solid imaging device comprising,

• the first process of forming a supporting means to have a rectangular donut configuration by use of easily shapeable material;
• the second process of adhesively attaching a cover means on a supporting face of the supporting means, wherein the cover means is an optically transparent and physically rigid plate;
• the third process of matching the cover means with a image sensor area on a wafer to attach the supporting means to a periphery of the image sensor;
• the fourth process of dicing the image sensor from the wafer;
• the fifth process of die bonding the diced image sensor to a ceramic package or PCB;
• and
• the sixth process of wire bonding a pad portion of the image sensor to the package or PCB and molding the image sensor.

A method of fabricating a solid imaging device comprising,

• the first process of bonding a plate means onto an upper surface of an image sensor on a wafer by use of a transparent bond, wherein the plate means is a optically transparent and physically rigid;
• the second process of dicing the image sensor to which the plate means is bonded from the wafer;
• the third process of die bonding the diced image sensor to a ceramic package or PCB;
• and
• the fourth process of wire bonding a pad portion of the image sensor to the package or PCB and molding the image sensor.