Common electrode wire for plating

Abstract

A common electrode line for plating for collectively forming conductive patterns of a plurality of circuit substrates on a main substrate, and for plating the conductive patterns of the plurality of circuit substrates at the same time by the common electrode lines for plating, wherein the common electrode lines for plating 22 respectively connected to pads 14 of the plurality of circuit substrates 20A are formed on both front and back surfaces of the main substrate and connected via through holes 11, the common electrode lines for plating are wired from the circuit substrate across a cut line which divides a substrate into the plurality of circuit substrates on any of the front and back surfaces.

Dependencies are inferred from the claim text.