Vacuum evaporation apparatus
AssigneePrinco Corp.
InventorsYing-Che Shih, Pei-Liang Chiu
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Abstract
The present invention discloses a vacuum evaporation apparatus comprising a vacuum pump, an evaporation chamber and a power supply. The evaporation chamber comprises a substrate, an evaporation source and an evaporation mask. The evaporation mask exhibits a coefficient of thermal expansion substantially equal to the substrate, and the evaporation mask has a pattern of metal tracks. Thus, the apparatus of the present invention also can be applied to form solder bumps on a large sized silicon wafer. Moreover, the position pattern of the mask is formed by an anisotropic etching process; the diameter of the pattern will not be influenced by the thickness of the mask. Therefore, the tendency of the solder bumps with the smaller size and the pitch are met.
Claims12
A vacuum evaporation apparatus comprising a vacuum pump, an evaporation chamber and a power supply, characterized in that said evaporation chamber comprises:
- (a) a substrate, whose surface is disposed by metal tracks;
- (b) an evaporation source;
- and
- (c) an evaporation mask exhibiting a coefficient of thermal expansion substantially equal to said substrate, and said evaporation mask having a pattern of said metal tracks;
- whereby the coefficients of thermal expansion of said silicon mask and said silicon wafer are the same, a pattern shift on said evaporation mask is improved thereof.
Dependencies are inferred from the claim text.