Loading patent…
AssigneeKoninklijke Philips Electronics N.V.
InventorsFranciscus Gerardus Maria De Jong, Rodger Frank Schuttert, Johannes De Wilde
Estimating the term…
An integrated circuit assembly contains a carrier and a semi-conductor integrated circuit chip 10. A current path on the carrier supplies power to power supply connection of the chip. A magnetic field sensor is provided on the carrier in a vicinity of the current path, for sensing a magnetic field generated by a current through the current path. The assembly contains test-accessible electronic interface to the magnetic field sensor, for testing presence of the current. Preferably the sensors are integrated on the carrier by depositing magneto resistive material and patterning the material so as to provide sensors in the vicinity of current paths. Also preferably, the carrier is an interposer 12 with connecting wiring, which is packaged with one or more integrated circuit chips before mounting the interposer on a printed circuit board 19.
An integrated circuit assembly, comprising
A method of testing an integrated circuit assembly with an integrated circuit chip attached to a carrier with current paths for giving access to circuits in the integrated circuit chip, comprising measuring an electric voltage representative of a magnetic field generated by a power supply current on the interposer, wherein a sensor for the magnetic field is used that is integrated on the carrier, outside the integrated circuit.
Carrier for mounting one or more integrated circuit chips, the carrier comprising
Dependencies are inferred from the claim text.