Semiconductor substrate and thin-film semiconductive member, and method for making thereof
AssigneeSony Corporation
InventorHiroshi Tayanaka
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AssigneeSony Corporation
InventorHiroshi Tayanaka
Estimating the term…
A semiconductor substrate comprises a porous semiconductor having a porous layer with an impurity concentration distribution varying in the depth direction. Alternatively, the semiconductor substrate comprises a porous layer comprising a porous semiconductor containing an impurity with a content of 1×1018 cm−3 or more, or comprises a porous layer provided by pore formation in an epitaxial growth layer. A thin-film semiconductive member is formed on one surface of a supporting substrate with a porous layer provided having the above-mentioned configuration therebetween, and separated from the supporting substrate by cleavage in the porous layer. In a method for making a semiconductor substrate, a variant impurity layer with an impurity concentration varying in the depth direction is formed on one surface of a supporting substrate. Next, the variant impurity layer is converted into a porous layer having a variant porosity in the depth direction. In a method for making thin-film semiconductive member, a semiconductive thin film is formed and is separated from the supporting substrate by cleavage in the porous phase, in addition to the method for making the semiconductor substrate.
A semiconductor substrate comprising a porous semiconductor having a porous layer with an impurity concentration distribution varying in the depth direction.
A semiconductor substrate comprising a porous layer comprising a porous semiconductor containing an impurity with a content of 1×1018 cm−3 or more.
A semiconductor substrate comprising a porous layer provided by pore formation in an epitaxial growth layer.
A thin-film semiconductive member formed on one surface of a supporting substrate with a porous layer provided therebetween, and separated from said supporting substrate by cleavage in said porous layer, said porous layer comprising a porous semiconductor having an impurity concentration varying in the depth direction.
A thin-film semiconductive member formed on one surface of a supporting substrate with a porous layer provided therebetween, and separated from said supporting substrate by cleavage in said porous layer, said porous layer comprising a porous semiconductor having an impurity concentration of 1×1018 cm−3 or more.
A thin-film semiconductive member formed on one surface of a supporting substrate with a porous layer provided therebetween, and separated from said supporting substrate by cleavage in said porous layer, said porous layer being provided by pore formation in an epitaxial growth layer.
A method for making a semiconductor substrate comprising:
A method for making a semiconductor substrate comprising:
A method for making a thin-film semiconductive member comprising:
A method for making a thin-film semiconductive member comprising:
Dependencies are inferred from the claim text.