Chip photoelectric sensor assembly and method for making same

A chip photoelectric sensor assembly comprising:

• a substrate provided on an upper surface thereof with a printed circuit board mounted thereon, and a plurality of bonding wires, said substrate further provided in an underside thereof with a plurality of soldering pads;
• a photoelectric sensor chip provided in the center of an upper surface thereof with a plurality of photoelectric sensors and a photosensitive area formed by said photoelectric sensors, said photoelectric sensor chip further provided on the upper surface thereof with a plurality of electric connection ports whereby said photoelectric sensor chip is mounted on said substrate such that said electric connection ports of said photoelectric sensor chip are connected with said bonding wires of said substrate;
• a protective covers made of an electrically-insulating resin and shielding said electric connection ports and said bonding wires;
• and
• a light-permeable protective layer masking said photosensitive area of said photoelectric sensor chip whereby said light-permeable protective layer has a thickness ranging between 1 and 10 microns.