Spraying method of a dispense system
AssigneeWinbond Electronics Corp.
InventorChing-Shyong Shyu
Life of this patent
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Abstract
A spraying method of a dispense system for preventing residue, wherein a precise amount of stream fluid is supplied from a fluid supply through a main tube to a nozzle, and the precise amount of stream fluid is sprayed onto a surface of a wafer. A sub-tube system, which comprises a bypass valve and a pin hole is utilized to refill the fluid to a void. A metering valve is used as a suck-back system to retrieve the remaining fluid in the main tube and prevent residue from occurring.
Claims19
A method of a dispense system, for preventing residue, wherein the steps of the method comprise:
- performing a spray process, wherein a precise amount of stream fluid is supplied from a fluid supply through a main tube to a nozzle, wherein when the spray process stops, a void is formed at an end of the main tube;
- performing a refilling process, wherein the fluid is supplied slowly from a buffer tube to the main tube, and refills the void in the main tube, when the fluid level in the main tube reaches a predetermined level, the refilling process stops;
- performing a suck-back process, wherein the remaining fluid in the main tube is suck backed to a certain level.
An apparatus of a dispense system that prevents residue, the apparatus comprising:
- a main tube, wherein one end of the main tube is connected to a fluid supplier and the other end of the main tube is connected to a nozzle, wherein a suck back valve and a main valve are both connected to the main tube;
- and
- a buffer tube, wherein one end of the buffer tube is connected to the main tube and the other end of the buffer tube is connected to a pin hole, wherein the pin hole is then connected to the main tube, and a buffer valve is located at the buffer tube.
Dependencies are inferred from the claim text.