Device comprising micromagnetic components for power applications and process for forming device

A device comprising a multilayer component that comprises:

• a substrate comprising an integrated circuit device;
• a first insulating and planarizing photoresist layer formed over the substrate;
• a first magnetic material layer or a first electrically conductive material layer formed over the first insulating photoresist layer;
• a second insulating and planarizing photoresist layer formed over the first magnetic material layer or the first electrically conductive material layer;
• and
• a second magnetic material layer or a second electrically conductive material layer formed over the second insulating and planarizing photoresist layer.

A process for fabricating an article, comprising the steps of:

• forming a metal seed layer comprising gold over a substrate;
• forming a patterned photoresist layer over the seed layer;
• electroplating an electrically conductive material onto the seed layer in the pattern defined by the patterned photoresist layer;
• removing the patterned photoresist layer subsequent to electroplating;
• oxidizing the surface of the electrically conductive material subsequent to removing the photoresist layer;
• removing exposed areas of the seed layer after removal of the photoresist layer;
• and
• removing the oxide from the surface of the electrically conductive material subsequent to removal of the exposed areas of the seed layer.