Cooling system
AssigneeApplied Materials, Inc.
InventorTien-En Hsiao
Life of this patent
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Abstract
A cooling system and a semiconductor apparatus, in which the cooling system may supply a reaction chamber with a coolant (such as helium or a mixture containing helium) during a semiconductor wafer fabrication process. The cooling system may generally include a printed circuit board, a coolant flow controller having a setpoint control to set a flow of coolant by transmitting a voltage signal to the printed circuit board, and a filter for removing undesired noise from the voltage signal to stabilize the flow of coolant.
Claims25
A cooling system for supplying a reaction chamber with coolant during a semiconductor fabrication process;
- said cooling system comprising:
- coolant supply circuitry which controls supply of said coolant;
- a coolant flow controller having a setpoint control to set a flow of said coolant by transmitting a voltage signal to said circuitry;
- and
- a filter for removing noise from said voltage signal to stabilize said flow of said coolant.
An apparatus for manufacturing semiconductor devices;
- said apparatus comprising:
- a chamber for performing a semiconductor process on a wafer therein;
- a control system that controls a flow of coolant to cool the wafer when the semiconductor process is performed;
- said control system having a setpoint control to set the flow of coolant by transmitting a voltage signal;
- and
- a filter for removing noise from said voltage signal.
Dependencies are inferred from the claim text.