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US 2002/0152926 A1Published application
Method for copper plating deposition
AssigneeInteruniversitair Microelektronica Centrum
InventorsRoger Palmans, Yuri Lantasov
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Abstract
The present invention describes a method for copper deposition on a substrate having a barrier layer wherein a substrate (2) and an activator (1) are immersed in a copper plating bath in order to contact each other for a predetermined period.
Claims17
A plating method for copper deposition on a substrate having a barrier layer, the method comprising the steps of:
- immersing the substrate in a copper plating bath;
- immersing an activator in said copper plating bath;
- and
- performing a direct contact between said activator and said substrate for a time period, whereby copper is deposited on said substrate.
1 more element
A solution comprising:
- a source copper Cu (II) ions;
- a complexing agent to keep Cu(II) ions in solution at high pH;
- and
- an additive, wherein said additive is capable of adjusting a pH of said bath to between 12.0 and 13.5.
1 more element
Dependencies are inferred from the claim text.