Sensor micro-machined with electrolytic welding and method for making same
AssigneeThales
InventorsBertrand Leverrier, Marie-Dominique Bruni-Marchionni
Life of this patent
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AssigneeThales
InventorsBertrand Leverrier, Marie-Dominique Bruni-Marchionni
Estimating the term…
The invention relates to sensors of physical quantities such as pressure sensors or acceleration sensors, and more specifically to the mounting of the active part of the sensor on a base (30) bearing connection pins (32). According to the invention, an active part of the sensor, consists for example of micro-machined silicon wafers (10, 12) bearing electronic elements, electrical conductors, and connection pads (22). A base (30) is also prepared, provided with pins (32) whose upper ends are spatially arranged, with each one facing a respective pad (22). The face bearing the pads is applied to the upper part of the pins, and the unit is dipped into an electrolytic bath to deposit metal (34) that rigidly solders the pins to the pads. Preferably, the conductive parts (pins and pads) of the unit are then covered with an insulator (36) to prevent electrical leakage between pins subjected to different potentials.
Sensor of physical quantities comprising at least one micro-machined wafer (12) provided with conductive connection pads (22) on a main face, and a base (30) provided with conductive connection pins, the main face being turned towards the base and each connection pad facing a corresponding pin end, an electrolytic deposit of metal or metals (34) coating the end of each pin and the corresponding connection pad so as to set up a rigid fastening between this end and the pad.
Sensor according to one of the above claims, characterized in that it constitutes a sensor of pressure, stresses, gas or liquid.
Method for the manufacture of a sensor of physical quantities, consisting of the preparing of an active sensor part (10, 12) and a base (30), the active part comprising at least one wafer (12) provided with connection pads (22) on a front face, and the base being provided with conductive pins (32) whose ends are arranged spatially so that each end rests against a respective pad (22) of the wafer when the front face of this wafer is brought closer to the base;
Dependencies are inferred from the claim text.