US 2002/0152611 A1 · Thin core substrate for fabricating a build-up circuit board

Abstract

Disclosed is a method of preparing a thin core substrate for fabricating a build-up multilayer circuit board. The method involves the use of an insulating layer which is covered with the electrically conductive sheets. The openings are made in the electrically conductive layers at the predetermined positions, where the vias are also formed in the insulating layer. An electrically conductive layer is deposited to cover the vias. After the electrically conductive sheets and layer are patterned, a thin core substrate is constructed. The build-up layers are then made at least one side of the thin core substrate to form a build-up multilayer circuit board.

Claims10

Dependent claims

A method of making a thin core substrate for constructing a build-up multilayer circuit board, comprising:

an insulating layer having a first surface and a second surface opposite said first surface;
a first electrically conductive sheet being bonded to said first surface of said insulating layer, and a second electrically conductive sheet being bonded to said second surface of said insulating layer;
removing the conductive material in said electrically conductive sheets and the insulating material in said insulating layer at the same predetermined positions to form a plurality of blind vias;
depositing an electrically conductive layer covering said blind vias;
patterning said first, second conductive sheets and said conductive layer to form circuit layers.

2 more elements

Dependencies are inferred from the claim text.

Thin core substrate for fabricating a build-up circuit board

Life of this patent

Thin core substrate for fabricating a build-up circuit board

Life of this patent

Abstract

Claims10