Wafer abrasive machine

An abrasive machine, in which a surface of a wafer held by a holding plate is pressed onto an abrasive face of an abrasive plate and relatively moved with respect thereto so as to abrade the surface of the wafer,

• comprising:
• a head member including a concave section, in which the holding plate, whose wafer holding face is headed toward the abrasive face of the abrasive plate, and a dress ring, which encloses the holding plate and presses the abrasive face of the abrasive plate so as to make it flat, are accommodated;
• an elastic sheet member suspending the holding plate and the dress ring and biasing the both toward an inner part of the concave section of said head member, said elastic sheet member being reinforced by a cloth-formed reinforcing member;
• a space for storing pressure fluid which pushes the holding plate toward the abrasive plate against elasticity of said elastic sheet member, said space being formed between said elastic sheet member and an inner upper face of the concave section of said head member;
• and
• a plurality of spherical bodies being provided between an outer circumferential face of the holding plate and an inner circumferential face of the dress ring and between an outer circumferential face of the dress ring and an inner circumferential face of the concave section of said head member, said spherical bodies simultaneously point-contact the circumferential faces.