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US 2002/0119679 A1Published application
Method and apparatus for preventing rapid temperature variation during processing
AssigneeOki Electric Industry Co., Ltd.
InventorMasahisa Ikeya
Life of this patent
Estimating the term…
Abstract
In a method for fabricating a semiconductor device, a semiconductor wafer is thermally treated with a wafer treatment device. The semiconductor wafer is delivered with a conveyer to the wafer treatment device. The temperature of the conveyer is controlled to have an optimum temperature.
Claims28
A method for fabricating a semiconductor device, comprising the steps of:
- thermally treating a semiconductor wafer with a wafer treatment device;
- delivering the semiconductor wafer with a conveyer to the wafer treatment device;
- and
- controlling the temperature of the conveyer to have an optimum temperature.
1 more element
An apparatus for fabricating a semiconductor device, comprising:
- a wafer treatment device which applies a thermal treatment to a semiconductor wafer;
- a conveyer which delivers the semiconductor wafer to and from the wafer treatment device;
- and
- a controller which controls the temperature of the conveyer to have an optimum temperature.
1 more element
An apparatus for fabricating a semiconductor device, comprising:
- a wafer heater which heats a semiconductor wafer to a first temperature;
- a wafer cooler which cools the semiconductor wafer, which has been heated by the wafer heater, to a second temperature;
- a wafer conveying arm which delivers the semiconductor wafer;
- and
- an arm heater which heats the wafer conveying arm to have an optimum temperature, determined between the first and second temperatures.
2 more elements
An apparatus for fabricating a semiconductor device, comprising:
- a wafer heater which heats a semiconductor wafer to a first temperature;
- a wafer cooler which cools the semiconductor wafer, which has been heated by the wafer heater, to a second temperature;
- first and second conveying arms which deliver the semiconductor wafer;
- an arm heater which heats the first conveying arm to have an optimum temperature, determined between the first and second temperatures;
- and
- an arm cooler which cools the second conveying arm to have an optimum temperature.
3 more elements
An apparatus for fabricating a semiconductor device, comprising:
- a wafer heater which heats a semiconductor wafer to a first temperature;
- a wafer cooler which cools the semiconductor wafer to a second temperature;
- a conveying arm which delivers the semiconductor wafer;
- and
- a temperature controller which controls the temperature of the conveying arm to have the optimum temperature.
2 more elements
Dependencies are inferred from the claim text.