Semiconductor device and method of manufacturing same

A method of manufacturing a semiconductor device, comprising:

• providing a lead frame including an array of mounting portions, each of the mounting portions having an island for mounting a semiconductor chip thereon and having a plurality of lead terminals, wherein said lead frame comprises a bottom plate having a lower surface contiguous to and lies flush with lower surfaces of said islands and lead terminals;
• mounting a semiconductor chip on a surface of the island;
• electrically connecting the semiconductor ship to the lead terminals;
• forming a resin layer so as to cover the semiconductor chip, the surface of the island, and surfaces of the lead terminals;
• removing said bottom plate so as to expose the islands and the lead terminals on lower side of the lead frame;
• depositing plated layers of a soldering material on the islands and the lead terminals on lower side thereof;
• and
• separating the lead frame so as to form a package including a region surrounding the island and the lead terminals electrically connected to the semiconductor chip mounted on the island.