Method for fabricating thermoelectric coolers and semiconductor devices formed therefrom

Abstract

A system and method for fabricating a thermoelectric cooling (TEC) device and a semiconductor device using such a TEC device are described. Adhesive-containing support structures are used to secure, respectively, positively-doped and negatively-doped TEC elements. The elements are intermeshed and an encapsulating material is applied to the intermeshed array. The support structures are then released and the ends of the encapsulated elements are smoothed and electrically coupled together. If desired, panels are secured to the ends of the elements and a heat sink may also be provided. The TEC device may be used to control and/or tune a laser device.

Dependencies are inferred from the claim text.