Heat sink, semiconductor laser device, semiconductor laser module and raman amplifier
AssigneeFurukawa Electric Co., Ltd.
InventorsSadayoshi Kanamaru, Toshio Kimura
Life of this patent
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AssigneeFurukawa Electric Co., Ltd.
InventorsSadayoshi Kanamaru, Toshio Kimura
Estimating the term…
At least one bevel is formed on the top of a heat sink on which a semiconductor laser diode is placed, the bevel being sloped from either side of first or second optical system downwardly toward the bottom of the heat sink. Thus, the heat radiation area of the heat sink can be increased without blocking of the laser beam emitted from the semiconductor laser diode and without engagement of the heat sink with the first and second optical systems. As a result, the optical output of a semiconductor laser module using such a semiconductor laser diode can be increased. The semiconductor laser module can be applied to even a pump light source used in Raman amplification and required to have a high-power.
A heat sink on the top of which a semiconductor laser diode is placed, comprising at least one bevel formed on said top to extending downwardly toward the bottom of said heat sink.
A semiconductor laser device comprising:
A semiconductor laser module comprising:
A Raman amplifier comprising:
Dependencies are inferred from the claim text.