High power amplifier and chassis
AssigneeAndrew Corporation
InventorPeter T. Baker
Life of this patent
Estimating the term…
Abstract
A power amplifier assembly combines a single printed circuit board with a housing for providing isolation between subcircuits of the circuit board. The printed circuit board is provided with four conductive layers and contains a power supply subcircuit, an upconverter subcircuit, a monitor and control subcircuit, a low power gain subcircuit, and a high power gain subcircuit. The printed circuit board is further provided with plated-through vias in an isolation path which, in conjunction with internal chassis lid walls, serves to increase electromagnetic and radio frequency isolation between subcircuits on the printed circuit board.
Claims46
A power amplifier comprising:
- a single circuit board having a plurality of subcircuits thereon;
- a chassis body and a lid structure for coupling with the chassis body to contain the circuit board;
- at least one wall extending from the lid structure and surrounding a subcircuit to electrically isolate the subcircuit from other subcircuits on the circuit board.
A power amplifier comprising:
- a single circuit board having a plurality of subcircuits thereon;
- a chassis body with a conductive ground surface;
- a lid structure for coupling with the chassis body to contain the circuit board, the lid structure including walls extending therefrom to electrically isolate the subcircuits from each other;
- a ground isolation path formed in the circuit board and surrounding at least a portion of one of the subcircuits, a lid structure wall being electrically coupled to the ground isolation path for isolating the subcircuit.
A power amplifier comprising:
- a multiple-layer circuit board having a plurality of subcircuits thereon and defining a ground plane in one of the layers;
- a chassis body and a lid structure for coupling with the chassis body to contain the circuit board, the circuit board ground plane layer being coupled to the chassis body;
- a plurality of plated vias extending through the circuit board to electrically couple to the ground plane layer, the plurality of vias forming a ground isolation path positioned between at least two subcircuits;
- at least one wall extending from the lid structure and coupled to the ground isolation path to electrically isolate the subcircuit from other subcircuits on the circuit board.
A power amplifier comprising:
- a single circuit board having a power supply subcircuit and a high power gain subcircuit thereon;
- a chassis body and a lid structure for coupling with the chassis body to contain the circuit board;
- at least one wall extending from the lid structure and disposed between the power supply and high power gain subcircuits to electrically isolate those subcircuits.
A method of isolating subcircuits of a power amplifier comprising:
- positioning a plurality of subcircuits on a single circuit board;
- mounting the circuit board in a chassis body;
- positioning a lid structure having walls extending therefrom over the circuit board such that the walls surround at least one subcircuit and electrically isolate it from another subcircuit.
A method of isolating subcircuits of a power amplifier comprising:
- positioning a plurality of subcircuits on a single circuit board;
- mounting the circuit board in a chassis body;
- positioning a lid structure having a wall extending therefrom over the circuit board such that the wall surrounds at least one subcircuit and electrically isolates it from another subcircuit;
- forming an isolation ground path along a surface of the circuit board and coupling the wall with at least a portion of the isolation ground path for grounding the wall and the lid structure.
The method of claim 46 further comprising forming a plurality of plated vias to extend into the circuit board for forming the isolation ground path.
Dependencies are inferred from the claim text.