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AssigneeOMRON Corporation
InventorsMinoru Sakata, Takuya Nakajima, Tomonori Seki, Teruhiko Fujiwara, Masashi Takeuchi
Estimating the term…
A thin plate-shaped substrate 21 comprised of a monocrystal is provided with a piezoelectric element 24, and both ends of a movable piece 20 whose one surface is provided with a movable contact 25 are fixed and supported to a base 11. Then, by curving the movable piece 20 via the piezoelectric element 24, the movable contact 25 is brought in and out of contact with a pair of fixed contacts 38 and 39 that face the movable contact. With this arrangement, a subminiature micro-relay having a mechanical contact mechanism that has a small resistance in turning on the contact and the desired vibration resistance, frequency characteristic and insulating property can be obtained.
A micro-relay characterized by providing a thin plate-shaped substrate comprised of a monocrystal with a driving means, supporting on a base both ends of a movable piece at least one surface of which is provided with at least one movable contact and curving the movable piece via the driving means, thereby bringing the movable contact in and out of contact with a fixed contact that faces the movable contact, for making and breaking an electric circuit.
A micro-relay manufacturing method characterized by connecting and integrating via an insulating film a device wafer with an opening edge portion of a box-shaped base comprised of a handle wafer and thereafter cutting a pair of parallel slits through the device wafer, thereby forming a movable piece.
A matrix relay characterized by providing a thin plate-shaped substrate comprised of a monocrystal with a driving means, arranging in parallel a plurality of movable pieces in an insulated state whose one surface is provided with a movable contact, fixing and supporting on a base both ends of the movable pieces, and individually curving the movable pieces via the driving means, thereby bringing the movable contact in and out of contact with a fixed contact formed on a ceiling surface of a cover positioned above the base, for making and breaking an electric circuit.
An electronic component characterized by connecting and integrating a cover made of a glass material with a base made of a silicon material and resin-molding an electronic component chip assembled with an internal component on a substructure so that the cover is coated with the mold and a bottom surface of the base is exposed.
Dependencies are inferred from the claim text.