Wafer chuck having a removable insert
AssigneeInternational Business Machines Corporation
InventorsRobert K. Leidy, Paul D. Sonntag
Life of this patent
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AssigneeInternational Business Machines Corporation
InventorsRobert K. Leidy, Paul D. Sonntag
Estimating the term…
A vacuum chuck/insert assembly (100) for firmly supporting a semiconductor wafer (106) during wafer processing. The vacuum chuck comprises a chuck (102) and a removable insert (104). The chuck includes a base (108) and a plurality of spacers (112) for holding the insert in spaced relationship to the base of the chuck. The chuck further includes first and second vacuum seals (116, 118) and vacuum ports (128) extending through the base of the chuck. The insert includes a base (132) and a plurality of spacers (136) for holding the wafer in spaced relationship to the base of the insert. The insert further includes a vacuum seal (140) and vacuum ports (146) extending through the base of the insert. During operation, vacuum applied to the vacuum chuck/insert assembly holds the insert firmly in contact with the chuck and the wafer firmly in contact with the insert.
A chuck/insert assembly for holding a workpiece, comprising:
An chuck/insert according to claim 11, wherein the diameter of each pinshaped structure is no greater than about 50 micrometers.
An vacuum chuck insert for supporting a first microelectronic wafer, comprising:
A method of forming an insert for a vacuum chuck from a body having a surface, comprising the steps of:
Dependencies are inferred from the claim text.