Off-center solder ball attach assembly
AssigneeTessera, Inc.
InventorWael Zohni
Life of this patent
Estimating the term…
Abstract
A connection component includes a dielectric element having a first surface and a second surface, and conductive pads on the first surface of the dielectric element, each conductive pad having a center. The connection component also includes conductive vias electrically connected to the conductive pads and extending toward the second surface of the dielectric element, each of the vias having an opening at one of the conductive pads. At least one of the via openings is offset from the center of at least one of the conductive pads.
Claims10
A connection component comprising:
- a dielectric element having a first surface and a second surface;
- conductive pads on the first surface of the dielectric element, each conductive pad having a center;
- conductive vias electrically connected to said conductive pads and extending toward the second surface of said dielectric element, each said via having an opening at one of said conductive pads, wherein at least one of the via openings is offset from the center of at least one of said conductive pads.
The connection component as claimed in claim 8, wherein said vias extend in a direction that intersects planes defined by the first and second surfaces of said dielectric element.
Dependencies are inferred from the claim text.