Light-emitting diode and its manufacturing method

A method for manufacturing a light-emitting diode comprising mounting, on a surface of a printed substrate, a light-emitting diode chip having a substrate, a semiconductor layer which is laminated on a surface of the substrate, is formed of an N-type semiconductor layer and a P-type semiconductor layer and has a light-emitting portion in the vicinity of a PN junction surface between the N-type and P-type semiconductor layers, a pair of electrodes for applying voltage to the semiconductor layer, and a light reflection layer reflecting light emitted from the light-emitting portion, thereby obtaining the light-emitting diode, the method comprising, for mounting the light-emitting diode chip on the printed substrate,

• the step of forming beforehand the light reflecting layer on a front surface or a back surface of the substrate of the light-emitting diode chip or in the light-emitting diode chip in such a manner that the light reflecting layer is approximately parallel to the PN junction surface, and
• the step of fixing the obtained light-emitting diode chip on the printed substrate so that the PN junction surface is perpendicular to the surface of the spring substrate and electrically connecting the pair of electrodes of the light-emitting diode chip to the printed substrate.