Electric component compression bonding machine and method

An electric component compression bonding machine for bonding a plurality of electric components to a substrate through a buffer element along a straight line, comprising:

• a pressure application tool for applying a pressure to said electric components;
• a pressure receiving tool located opposed to said pressure application tool;
• a substrate supporting tool for supporting said substrate between said pressure application tool and said pressure receiving tool;
• a buffer element supporting tool for supporting said buffer element between said pressure application tool and said substrate;
• a moving unit connected to at least one of said pressure application tool and said buffer element supporting tool for moving said pressure application tool relative to said buffer element supporting tool in said straight line;
• and
• a control unit for compression bonding said electric components to said substrate by controlling said pressure application tool.

An electric component compression bonding method for bonding a plurality of electric components to a substrate through a buffer element along a straight line, comprising:

• a step of arranging said plurality of electric components along said straight line on said substrate;
• and
• a step of moving said substrate relative to a pressure application tool to a position where said pressure application tool can perform compression bonding the entirety of one of said electric components located closest to one end of said substrate;
• and
• a step of moving said buffer element relative to said pressure application tool, before, after or at the same time as said pressure application tool moving step, in order that, during compression bonding, one end of said buffer element is located inside of said one end of said substrate and inside of one end of said pressure application tool close to said one end of said substrate.

An electric component compression bonding machine for bonding a plurality of electric components arranged in a row to a substrate, comprising:

• a pressure application tool for applying a pressure to said electric components;
• a pressure receiving tool located opposed to said pressure application tool;
• a substrate supporting tool for supporting said substrate between said pressure application tool and said pressure receiving tool;
• a moving unit for moving said substrate supported by said substrate supporting tool relative to said pressure application tool;
• a control unit connected to said moving unit and taking control of said moving unit in order to adjust the position of said substrate supported by said substrate supporting tool relative to said pressure application tool for compression bonding said electric components to said substrate by said pressure application tool,
• wherein said control unit controls said moving unit to adjust the position of said substrate supported by said substrate supporting tool relative to said pressure application tool in order that any one of the ends of said pressure application tool is positioned apart from said row of said electric components or positioned between adjacent ones of said electric components.