Chemical vapor deposition chamber lid assembly
AssigneeApplied Materials, Inc.
InventorsLily L. Pang, Thomas K. Cho, Tetsuya Ishikawa
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Abstract
A semiconductor substrate processing chamber is disclosed generally comprising a chamber body that has a semiconductor substrate support assembly disposed in the chamber body. A lid assembly is movably coupled to the chamber body via a dual pivot hinge assembly. The hinge assembly provides two pivot points that minimize the abrasion and pinching of an o-ring disposed between the lid assembly and the chamber body upon closing of the lid assembly.
Claims35
A semiconductor substrate process chamber comprising:
- a chamber body;
- at least one hinge assembly having a first inner pivot point and a second outer pivot point;
- and
- a lid coupled to said chamber body by said hinge assembly.
A semiconductor substrate process chamber comprising:
- a chamber body having a first surface;
- and
- a lid movably disposed on said first surface, said lid having a first center of rotation relative said chamber body over a first range of motion and a second center of rotation relative said chamber over a second range of motion.
A semiconductor substrate process chamber comprising:
- a chamber body;
- a lid movably disposed on said chamber body;
- at least one cam plate coupled to said lid, said cam plate having a first contoured surface and a second contoured surface;
- at least one hinge block coupled to said chamber body, said hinge block having an aperture;
- a cam follower coupled to said hinge block;
- and
- a shaft at least partially disposed in said aperture and coupled to said cam plate.
Dependencies are inferred from the claim text.