Chemical adsorption solution and method of producing chemically adsorbed film using the chemical adsorption solution
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorKazufumi Ogawa
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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorKazufumi Ogawa
Estimating the term…
The present invention provides a chemical adsorption solution prepared by dissolving a silane-based chemical adsorption material in a non-aqueous organic solvent, in which the non-aqueous organic solvent is a mixture including a first non-aqueous organic solvent and a second non-aqueous organic solvent having a boiling point higher than that of the first non-aqueous organic solvent. A preferable difference in the boiling point is at least 10° C. Preferably, the first non-aqueous organic solvent has a boiling point of not more than 120° C. and the second non-aqueous organic solvent has a boiling point of not less than 150° C. The chemical adsorption solution coated on a substrate is concentrated by evaporating the solvent having the lower boiling point, so that a chemically adsorbed film having a uniform film thickness can be formed in a short time.
A chemical adsorption solution comprising a silane-based chemical adsorption material dissolved in a non-aqueous organic solvent, wherein the non-aqueous organic solvent is a mixture of a first non-aqueous organic solvent and a second non-aqueous organic solvent having a boiling point higher than a boiling point of the first non-aqueous organic solvent.
A method of producing a chemically adsorbed film, comprising:
Dependencies are inferred from the claim text.