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US 2002/0058756 A1Published application
Underfill sealants with improved adhesion, improved resistance to moisture absorption and improved resistance to stress cracking
AssigneeLoctite Corporation
InventorMark M. Konarski
Life of this patent
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Abstract
This invention relates to thermosetting resin compositions useful as underfill sealants for mounting to a circuit board semiconductor device packages, which have a semiconductor chip on a carrier substrate. Reaction products of these compositions demonstrate improved adhesion after exposure to elevated temperature conditions, improved resistance to moisture absorption and improved resistance to stress cracking.
Claims36
A thermosetting resin composition, said composition comprising:
- (a) an epoxy resin component;
- (b) an adhesion promoter component having at least two secondary amine functional groups;
- and
- (c) a curative based on the combination of a nitrogen-containing compound and a transition metal complex, wherein the by weight ratio of epoxy resin component to adhesion promotor component is in the range of about 2:1 to about 20:1.
1 more element
A thermosetting resin composition, said composition comprising:
- (a) an epoxy resin component;
- (b) an adhesion promoter component having at least two secondary amine functional groups;
- (c) a curative based on the combination of a nitrogen-containing compound and a transition metal complex;
- and
- (d) a polysulfide-based toughening agent.
2 more elements
A thermosetting resin composition, said composition consisting essentially of:
- (a) an epoxy resin component;
- (b) an adhesion promoter component having at least two secondary amine functional groups;
- (c) a curative based on the combination of a nitrogen-containing compound and a transition metal complex;
- and
- (d) a polysulfide-based toughening agent.
2 more elements
Dependencies are inferred from the claim text.