Light-transmissive epoxy resin composition and flip-chip type semiconductor device

Abstract

A light-transmissive epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler satisfies formula (1): [{2(nA2+nC2)−(nA+nC)2}/2]½<3.0×10−3  (1) wherein nA is the refractive index at 25° C. of the cured product of the unfilled composition, and nC is the refractive index at 25° C. of the inorganic filler. The cured composition has improved heat resistance, humidity resistance and low stress as well as high transparency. The composition is suited for use as an underfill for flip-chip type semiconductor devices for optical communications.

Dependencies are inferred from the claim text.