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US 2002/0058347 A1Published application
Semiconductor package with a controlled impedance bus and method of forming same
AssigneeRambus Inc.
InventorsNader Gamini, Donald V. Perino
Life of this patent
Estimating the term…
Abstract
An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor devices at respective connection points.
Claims30
An apparatus, comprising:
- a first substrate having a plurality of semiconductor devices formed thereon;
- a second substrate;
- and
- a third substrate having thereon a data conductor coupled between first and second connections to the second substrate, the data conductor being coupled to the plurality of semiconductor devices at respective connection points.
1 more element
A semiconductor system, comprising:
- an interconnect channel including an input end to receive a set of input signals and an output end to route a set of output signals;
- and
- a plurality of semiconductor devices formed in a substrate, each semiconductor device of said plurality of semiconductor devices being designed for independent operability and being separated by scribe lanes within said substrate from adjacent semiconductor devices of said plurality of semiconductor devices, each semiconductor device including a set of input nodes and a set of output nodes formed on the surface of said substrate, said interconnect channel being positioned on said input nodes and said output nodes of each semiconductor device of said plurality of semiconductor devices, said set of input signals from said input end of said interconnect channel being applied to each semiconductor device of said plurality of semiconductor devices to produce said output signals at said output end of said interconnect channel.
A method of forming a semiconductor system, said method comprising the steps of:
- forming a plurality of semiconductor devices in a wafer, wherein each semiconductor device of said plurality of semiconductor devices is designed for independent operability and is electrically isolated within said substrate from adjacent semiconductor devices of said plurality of semiconductor devices by scribe lanes, said forming step including the step of forming within each semiconductor device, a set of input nodes and a set of output nodes on the surface of said substrate;
- grouping a set of semiconductor devices that are adjacent to one another on said wafer;
- and
- applying an interconnect channel to said set of semiconductor devices so as to electrically link input nodes and output nodes of each semiconductor device within said set of semiconductor devices.
1 more element
An integrated circuit package, comprising:
- a semiconductor substrate including a set of semiconductor devices separate by scribe lanes;
- and
- an interconnect channel extending across selected scribe lanes to electrically connect at least two semiconductor devices of said set of semiconductor devices.
Dependencies are inferred from the claim text.