Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective coating

Abstract

By blending novel organosiloxane polymers of the invention with a crosslinking agent and a photoacid generator, photo-curable resin compositions are formulated which can be exposed to radiation in a broad wavelength range and readily form a thin film without oxygen attack. From the compositions, fine patterns having improved dry etching resistance can be formed. Cured coatings of the compositions having improved substrate adhesion, heat resistance, and electrical insulation are suitable as a protective film for electric and electronic parts.

Dependencies are inferred from the claim text.